1. Copper foil industry standards are the world's authoritative standards: American ANSI/IPC STANDARD, European IEC standard, Jis Standard IPC-cf-150(1966.8) IPC-mf-150g (1999) IPC-249-3a (1976) JIS-c-6511(1992) JIS-c-6512(1992) JIS-c-6513(1996) Gb/t-5230(1995) March 2000, American Electronic Circuit Interconnection and Packaging Association (IPC) released "metal for printed boards" (4562) . The IPC (as)4562 standard is a world authoritative standard to regulate the variety, grade and performance of copper foil. It is world advanced and has replaced the IPC as -- MF 150g standard implemented by most copper foil manufacturers in the world. 

2. Classification of copper foil 01. According to different copper foil production methods, can be divided into calendering copper foil and electrolytic copper foil two categories. IPC as 4562, according to its manufacturing process, copper Foil electrodeposited by electrodeposition copper foil rolled by rolling copper foil, also known as wrought copper foil (wrought copper foil)02. The electrodeposited copper foil is rolled by rolling copper foil. Copper foil classification electrolytic copper foil has the following types: double treated copper foil double treated copper foil refers to electrolytic copper foil of rough surface treatment, the surface is also treated to roughen. High temperature elongation electrodeposited copper foil (HTE copper foil) copper foil with excellent elongation at high temperature (180 °C) , the elongation of copper foils of 35 m and 70 m thickness at high temperature (180 °C) should be kept above 30% of that at room temperature, also known as HD copper foil. Low profile copper foil low profile copper foil low profile copper foil low profile copper foil low profile copper foil low profile copper foil low profile copper foil low profile copper foil. The Ridge of the cross-section of the slice is undulating greatly. The Crystal of low profile copper foil is very fine (below 2 m) , equiaxed grain, without columnar crystal, lamellar crystal and flat edge. Resin coated copper foil resin coated copper foil (abbreviated as RCC) also known as Resin attached copper foil. Taiwan is known as: Copper Foil Back Glue. Foreign also known as: carried on the copper foil on the insulation resin sheet, with copper foil adhesive film. 03. Other categories of adhesive coated Copper Foil (ACC) is also known as "coated copper foil" . Copper foil products coated with Resin Glue on the roughened surface of copper foil. The General Resin adhesives are Acetal modified Phenol formaldehyde resin, epoxy acrylate Resin, butylcyanogen modified Phenol formaldehyde resin and so on. Gelatinize copper foil and resin coated copper foil (RCC) in the function is different, only as copper foil and insulation substrate bonding. Used for manufacturing paper-based copper clad laminate and three-layer flexible copper clad laminate. Copper Foil for Lithium Ion batteries copper foil for lithium ion batteries copper foil for the manufacture of negative current collectors for lithium ion batteries. The copper foil acts as both a carrier of negative electrode material and a collector and transmitter of negative electrode electrons in the lithium battery. The copper foil used must have good conductivity. It should ensure good contact with the active material and can be evenly coated on the negative material without falling off. It should have good contact with the activity, good corrosion resistance, smooth surface, thickness uniformity. Ultra thin copper foil ultra copper foil refers to copper foil for Printed Circuit Board Up to 9 m thick. Generally used copper foil, the outer layer of multilayer board is more than 12 m, the inner layer of multilayer board is more than 18 M. Copper foils up to 9M are used in the printed circuit board of microwires. Because the extremely thin copper foil is difficult to take out, there is generally a carrier as a support. The types of carriers are copper foil, aluminum foil, organic film and so on.

3. Copper foil in accordance with the characteristics of the quality assurance level of the difference is divided into three levels 1: Suitable for the requirements of Circuit Functional Integrity, Mechanical Properties and appearance defects, not important occasions. Level 2: Suitable for applications where circuit design, process and specification conformance requirements allow local area inconsistency. This level of material has a moderate level of assurance. Grade 3: This grade is suitable for applications requiring the highest level of quality assurance. Class 3 materials are used in military electronic equipment unless otherwise specified by both the supplier and the demander. Order without specifying the quality level shall be regarded as level 1. Appearance shall not be affected by the use of the appearance of defects 01. Pits and indentations shall not have pits and indentations with a diameter greater than 1.0 mm (for Grade 3 copper foil) ; pits and indentations with a diameter less than or equal to 1.0 mm shall not exceed 2 per 300 mm 300 mm area (for Grade 3 copper foil) ; For copper foil diameter less than 5% of the nominal thickness of pits and indentation can be ignored. 02. Wrinkle should not have permanent deformation of Wrinkle 03. The depth of scratches shall not exceed 20% of the nominal thickness of copper foil; for scratches with a depth of 5%-20% of the nominal thickness of copper foil, the number of scratches shall not exceed 3 per 300mm 300mm; for scratches with a depth of less than 5% of the nominal thickness of copper foil, its length, however long, is negligible. 04. Notches and tears shall not be notched and torn. 05. For 17 copper foils, the number of saturation points should not exceed 5 for every 300 mm and 300 mm, and for copper foils larger than 17 m, the number of saturation points should not exceed 3 for every 300 mm and 300 mm; The number of pinholes and air voids for copper foils less than 17 m shall be agreed between the supplier and the demander. 06. Cleanliness shall be free of dust, dirt, corrosion, salt, grease, fingerprints, foreign matter and other defects affecting the service life, processing performance or appearance of copper foil. 5. Size 01. Length and width of sheet copper foil length and width of sheet copper foil shall be specified in the procurement documents. The length and width allowed deviation is ± 3.2 mm or agreed by both the supplier and the demander. 02. Coil copper foil width coil copper foil width shall be in accordance with the provisions of the procurement documents, the width of the coil copper foil allowed deviation of ± 1.6 mm or by the supply and demand sides agreed. 03. The relationship between thickness, thickness per unit area and mass per unit area is as follows: The thickness of copper foil (m) = 0.112 mass per unit area (g/m2) , in which 0.112 is a coefficient determined by the density of copper of 8.93 g/cm3. For copper foils of 8.81 ~ 8.99 g/cm3, the error of the coefficient is within 1% . 6. Physical Properties 01. Solderability should not show signs of solder semi-wetting. 02. High temperature oxidation resistance. The surface of copper foil should not be oxidized and discolored when it is baked at 200 °C for 15 minutes or at 180 °C for 60 minutes. 03. Purity of copper foil the lowest purity of copper foil (in terms of silver content) without surface treatment shall meet the following requirements: calendered copper foil: 99.9% electrolytic copper foil: 99.8%

 source: network finish